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Using BBCube (Bumpless Build Cube), the Tokyo Institute of Technologies WOW Alliance and NCKU have come to an agreement on a technical partnership for the social deployment of next-generation 3D integrated technology. This is the first academic partnership between Japan and Taiwan for advanced 3D integration techniques.
The BBCube corporate alliance will be used to carry out the plans to achieve commercialisation. NCKU has joined the Tokyo Tech WOW Alliance in order to take part in the study and creation of cutting-edge 3D technology. This involves creating the appropriate human resources for its operation as well as building and testing a BBCube pilot manufacturing line inside the institution.
A business partnership between BBCube and TEX, a company founded by Professor Takayuki Ohba of Tokyo Tech’s Institute of Innovative Research, was reached. Both COW Technology and WOW Technology, which are built on the BBCube platform, will be transferred to NCKU by TEX. Processes, tools, and supplies will be used in accordance with the Tokyo Tech WOW Alliance’s research accomplishments.
The Tokyo Tech WOW Alliance is currently home to numerous universities and allied businesses that are working to build the next generation of semiconductor 3D technology. Due to the rise in atomic-scale unseen flaws, the semiconductor industry is approaching a time when production yields of cutting-edge semiconductor devices will become saturated.
As a result, COW chiplet integration and WOW wafer stacking technology will become increasingly crucial. In order to meet this need, Japan and Taiwan have formed a partnership that seamlessly aligns product and market orientation. It is anticipated that this partnership will advance the fundamental research and development of post-miniaturization 3D integrated technology, its application in society, and the semiconductor supply chain.